The medium is the message
Automating packaging and coding not only streamlines the process but also checks all of the boxes – efficiency and transparency, material traceability and sustainability.
Automating packaging and coding not only streamlines the process but also checks all of the boxes – efficiency and transparency, material traceability and sustainability.
Artificial intelligence (AI) in manufacturing is no longer a fascinating idea – it is already here and accelerating quickly throughout many industries, especially in the baking industry. Several reasons are fueling this revolution.
MULTIVAC Group acquired an 80% majority stake in Italianpack S.p.A., a manufacturer of automatic and semi-automatic packaging machines headquartered in Como, Italy. Italianpack will be incorporated into the MULTIVAC organization as a new business unit under the leadership of Tomaso Petrini, CEO of Italianpack.
ECD will bring its thermal profiling technology to iba in October. The handheld M.O.L.E.™ EV6 sets a new benchmark for thermal data loggers, delivering instantaneous data access and intuitive control – now with a full-color touchscreen display. In addition to the six-channel M.O.L.E. EV6, the company’s BreadOMETER™, CakeOMETER™, and OvenBALANCER™ sensors will be demonstrated at the stand.
KPM Analytics showcases solutions that meet growing trends such as automated product inspection, process control achieved with vision inspection, processing whole wheat/high-fiber products, at-line dough quality analysis, and ingredient quality control.
ECD’s M.O.L.E.™ EV6 touchscreen thermal profiler is now commercially available, with shipments starting April 1. The interface is said to have a user-friendly, intuitive design engineered to save baking professionals time, simplify data viewing and analysis, and improve productivity.
MULTIVAC is exhibiting solutions to pack bread, baked goods, fine pastries and snacks. In addition to two chamber machines, the exhibits also include a compact thermoform packaging machine and a tray sealer.