As preparations are in full swing for interpack 2023, exhibitors share solutions they are focusing on, information about new technologies that bakers can see at the show, as well as their views on the trade show and the industry.
Hall 5 C38
Handtmann focuses on integrative solutions for food and baked goods production from processing through to packaging, which are modular and flexible to configure. Live demonstrations include fully automated solutions for versatile products such as deposited products. “These modern processing methods will be supported by a large number of smart digital solutions that have been developed in-house by Handtmann and specifically adapted to these processes,” it anticipates.
The new solutions showcased at the stand include a fully automated dosing process, comprising the modules Handtmann VF 808 S vacuum filler and DS 552 dosing system with transfer to the denester and tray sealer packaging solution by its partner MULTIVAC. The DS 552 offers direct multi-lane dosing of a wide variety of products into thermo-forming packaging and trays or dough sheet systems. The automatic dosing process runs on 2 to 24 lanes and allows a production output of up to 200 cycles per minute. The dosing principle with return suction without filling pistons and valves can dose fluid to semi-viscous filling products with high precision. A large selection of dosing nozzles further extends the wide range of products. “The patented, servo-driven flow divider in the depositing system ensures a constant product flow without pressure fluctuations, resulting in the most accurate weights in every single lane.”
The technology concepts Handtmann presents include digitalization and automation features. “As a food innovator, Handtmann welcomes trade shows to bring its courage, creativity, understanding of trends and technological know-how to rethink classical products or develop concept products with this initially rather challenging novelty to the market.”
The article is part of an extended feature, which was originally published in [BBI 2 – 2023]. Read the full article in the magazine: