It’s not a sprint, it’s a marathon! DIOSNA iba preview
DIOSNA Hall A2 – 340 DIOSNA will present smart, future-oriented solutions for the food industry in the areas of automation,
DIOSNA Hall A2 – 340 DIOSNA will present smart, future-oriented solutions for the food industry in the areas of automation,
IPCO showcases its chocolate forming and molding equipment at interpack this year, with systems designed for the production of industrial ingredients – chips, chunks, drops and blocks – and decorative products such as shavings, rolls, pencils, or blossoms. Solutions can be customized for various operations, from start-up low-cost, rapid deployment equipment to high-capacity multi-layer systems.
Booth 1201 – Diosna Diosna will focus on equipment flexibility, showcasing the DIOSNA Wendel Mixer WH 240 “A” of the