It’s not a sprint, it’s a marathon! DIOSNA iba preview
DIOSNA Hall A2 – 340 DIOSNA will present smart, future-oriented solutions for the food industry in the areas of automation,
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IPCO highlights chocolate forming systems at interpack
IPCO showcases its chocolate forming and molding equipment at interpack this year, with systems designed for the production of industrial ingredients – chips, chunks, drops and blocks – and decorative products such as shavings, rolls, pencils, or blossoms. Solutions can be customized for various operations, from start-up low-cost, rapid deployment equipment to high-capacity multi-layer systems.
A guide to IBIE’s exhibition stands (Diosna)
Booth 1201 – Diosna Diosna will focus on equipment flexibility, showcasing the DIOSNA Wendel Mixer WH 240 “A” of the
MIWE: Baking technology live
Many things can be mapped digitally. But not everything! Nothing quite beats the real thing and exchanges between people. After
iba 2018 innovations: DIOSNA
Numerous exhibitors will present their innovations in Munich. The editors submit a couple of novelties to give trade fair visitors
