After a six-year break, DIOSNA returns to interpack with solutions for the food industry in the areas of fermentation, granulation and mixing.
A new wafer baking plate will be launched, which is set to feature an inlet that supports even heat distribution. The equipment will be presented on May 5. Another highlight at the stand will be Bühler’s SWAKT-Eco wafer baking oven.
IPCO showcases its chocolate forming and molding equipment at interpack this year, with systems designed for the production of industrial ingredients – chips, chunks, drops and blocks – and decorative products such as shavings, rolls, pencils, or blossoms. Solutions can be customized for various operations, from start-up low-cost, rapid deployment equipment to high-capacity multi-layer systems.
The exhibitor and product database for interpack 2023 can now be accessed online, providing an overview of the suite of products available.