Syntegon showcases turnkey solutions at ProSweets
At ProSweets, Syntegon will showcase confectionery industry solutions – from kitchen, depositing, and finishing technologies to packaging solutions.
At ProSweets, Syntegon will showcase confectionery industry solutions – from kitchen, depositing, and finishing technologies to packaging solutions.
Torsten Türling will be the new CEO of Syntegon Group from November 1, 2023, the packaging technology company announced. The current CEO, Dr. Michael Grosse, resigns as of October 31, after three years in this role.
Syntegon won the German Packaging Prize in the ‘packaging machines’ category, from the German Packaging Institute (Deutsches Verpackungsinstitut e.V.). Its IDH handling system incorporates innovative picker technology, which enables manufacturers to considerably reduce the space required from the infeed belt to the packaging machine
Syntegon published its first sustainability report, for fiscal year 2022 with reference to the sustainability reporting standard of the Global Reporting Initiative (GRI). Information about the company’s environmental, social, and responsible corporate governance practices is included.
Syntegon announced the launch of four machines for common vertical form, fill and seal applications at interpack. Two SVX variants, SVX Agile and SVX Duplex, were presented at the interpack booth, which will be launched this year along with two other SVX models.
At interpack, Syntegon is presenting a flexible line concept for packaging sensitive baked goods – from product distribution to case packaging. The seamlessly integrated packaging system comes with several novelties.
Reading Bakery Systems (RBS) designed a new 18-nozzle rotating die for increased throughput capacity. Depending on the size of the finished snack product, it increases throughput capacity by up to 33% on the same size production line.
Reading Bakery Systems (RBS) introduced a new ambient cooling conveyor, with increased efficiency in cooling crackers before entering packaging in a more‐compact footprint.