It’s not a sprint, it’s a marathon! DIOSNA iba preview
DIOSNA Hall A2 – 340 DIOSNA will present smart, future-oriented solutions for the food industry in the areas of automation,
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interpack: DIOSNA presents fermentation, granulation and mixing technology
After a six-year break, DIOSNA returns to interpack with solutions for the food industry in the areas of fermentation, granulation and mixing.
Pie production: AMF Tromp line
The automated line designed by AMF Tromp can flexibly support a wide range of pies, either savory or sweet, in a baking tray, in foils, or in paper cups. They can bake the pie shells only, pies with the top opened or closed and pies with or without a lattice decoration.
A guide to IBIE’s exhibition stands (Diosna)
Booth 1201 – Diosna Diosna will focus on equipment flexibility, showcasing the DIOSNA Wendel Mixer WH 240 “A” of the
AMF Bakery Systems introduces unified brand family
AMF Bakery Systems announced it unified its family of brands to highlight its equipment portfolio. The new brand architecture reflects AMF’s commitment to improvement and specialization, the company announced.
Centralized pizza dough production: DIOSNA
A total of three Diosna wendel mixers take care of dough mixing Staff in the American supply chain centers of
iba 2018 innovations: DIOSNA
Numerous exhibitors will present their innovations in Munich. The editors submit a couple of novelties to give trade fair visitors
