It’s not a sprint, it’s a marathon! DIOSNA iba preview
DIOSNA Hall A2 – 340 DIOSNA will present smart, future-oriented solutions for the food industry in the areas of automation,
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interpack: DIOSNA presents fermentation, granulation and mixing technology
After a six-year break, DIOSNA returns to interpack with solutions for the food industry in the areas of fermentation, granulation and mixing.
Cutting straight to the chase
For smaller and medium-sized operations and their footprint challenges, BAKON recently added a new solution to its portfolio of cutting equipment: the Pico ultrasonic cutting machine. The Dutch specialist introduced this solution in 2022 to bring an additional choice to its range of cutters.
A guide to IBIE’s exhibition stands (Diosna)
Booth 1201 – Diosna Diosna will focus on equipment flexibility, showcasing the DIOSNA Wendel Mixer WH 240 “A” of the
BAKON launches Pico ultrasonic cutting machine
BAKON introduced a new ultrasonic cutting machine, the PICO, designed for operations with smaller production volumes. It can be used for round and rectangular cakes, as well as for triangle-shaped products, in trays, or on cutting boards.
