Every season sparks pie joy
Whether the pies have an open top – covered with various ingredients, or are closed with dough, lattice, or crumble, the technology needs to produce excellent results no matter the recipe and material changes.
LIBRARY ARTICLES
Pizza in any shape and form
Ever the safe-choice favorite, but never a boring idea: pizza enjoys great diversity, to match all tastes, eating occasions, and
Optimum process for a world of sourdoughs
No two sourdoughs are the same; its value lies in its diversity. Perfecting different sourdough specialties relies on process accuracy and stability, with optimum kneading and mixing parameters for each type of product.
Simply sourdough
DIOSNA contributed to this article No two sourdoughs are the same; its value lies in its diversity. Perfecting different sourdough
Syntegon showcases turnkey solutions at ProSweets
At ProSweets, Syntegon will showcase confectionery industry solutions – from kitchen, depositing, and finishing technologies to packaging solutions.
New CEO for Syntegon Group: Torsten Türling
Torsten Türling will be the new CEO of Syntegon Group from November 1, 2023, the packaging technology company announced. The current CEO, Dr. Michael Grosse, resigns as of October 31, after three years in this role.
Syntegon wins fourth German Packaging Award
Syntegon won the German Packaging Prize in the ‘packaging machines’ category, from the German Packaging Institute (Deutsches Verpackungsinstitut e.V.). Its IDH handling system incorporates innovative picker technology, which enables manufacturers to considerably reduce the space required from the infeed belt to the packaging machine
It’s not a sprint, it’s a marathon! DIOSNA iba preview
DIOSNA Hall A2 – 340 DIOSNA will present smart, future-oriented solutions for the food industry in the areas of automation,
Syntegon launches vertical bagging series
Syntegon announced the launch of four machines for common vertical form, fill and seal applications at interpack. Two SVX variants, SVX Agile and SVX Duplex, were presented at the interpack booth, which will be launched this year along with two other SVX models.
interpack: DIOSNA presents fermentation, granulation and mixing technology
After a six-year break, DIOSNA returns to interpack with solutions for the food industry in the areas of fermentation, granulation and mixing.
Syntegon showcases packaging system for baked goods
At interpack, Syntegon is presenting a flexible line concept for packaging sensitive baked goods – from product distribution to case packaging. The seamlessly integrated packaging system comes with several novelties.
DIOSNA and MIWE organize sourdough seminar
DIOSNA and MIWE held a seminar sharing their expertise on how to perfect sourdough bread processing. Participants from 11 bakeries took part in the event at the MIWE live baking center, on February 15.
