Pizza in any shape and form
Ever the safe-choice favorite, but never a boring idea: pizza enjoys great diversity, to match all tastes, eating occasions, and
Ever the safe-choice favorite, but never a boring idea: pizza enjoys great diversity, to match all tastes, eating occasions, and
Czech Republic specialist J4 looks at the optimum baking curve for a wide variety of products when designing its tunnel ovens. To ensure it is consistently being reached, each step (and its dedicated zone) of the baking process is controlled.
Bundy Baking has enjoyed successful business worldwide over the past years, with American Pan strengthening its foothold in Europe.
Syntegon won the German Packaging Prize in the ‘packaging machines’ category, from the German Packaging Institute (Deutsches Verpackungsinstitut e.V.). Its IDH handling system incorporates innovative picker technology, which enables manufacturers to considerably reduce the space required from the infeed belt to the packaging machine
American Pan is preparing to exhibit a comprehensive range of baking solutions at iba, including those from Runex and Turbel, companies that joined the Bundy Baking Solutions group since the last iba. The focus will be on eco-friendly solutions, energy-efficient and smart equipment.
DIOSNA Hall A2 – 340 DIOSNA will present smart, future-oriented solutions for the food industry in the areas of automation,
Rademaker presents production solutions and emerging bakery products at iba 2023, including the new Radini bread line (previously designed for pastries) and a new depositing solution. The Radilinq rack loader and unloader will also be presented.
Syntegon announced the launch of four machines for common vertical form, fill and seal applications at interpack. Two SVX variants, SVX Agile and SVX Duplex, were presented at the interpack booth, which will be launched this year along with two other SVX models.
At interpack, Syntegon is presenting a flexible line concept for packaging sensitive baked goods – from product distribution to case packaging. The seamlessly integrated packaging system comes with several novelties.
As preparations are in full swing for interpack 2023, exhibitors share solutions they are focusing on, information about new technologies
Bundy Baking Solutions will feature its latest innovations including new American Pan ePAN designs for bread tin sets and the AccuTech Pan Greaser from its newest brand, Synova.
DIOSNA launched a new IoT solution for dough production. The system monitors the condition and product quality through live data. It can be accessed remotely.