Syntegon showcases turnkey solutions at ProSweets
At ProSweets, Syntegon will showcase confectionery industry solutions – from kitchen, depositing, and finishing technologies to packaging solutions.
At ProSweets, Syntegon will showcase confectionery industry solutions – from kitchen, depositing, and finishing technologies to packaging solutions.
While recipe variations for baguettes and bread rolls are not only to be expected but also make for unique selling points, high hydration rates and long dough resting times are the calling card of more sophisticated, authentic premium products.
As the finishing line to this year’s iba preparations is quickly approaching, here are exhibitor stands worth marking in visiting
ECD will bring its thermal profiling technology to iba in October. The handheld M.O.L.E.™ EV6 sets a new benchmark for thermal data loggers, delivering instantaneous data access and intuitive control – now with a full-color touchscreen display. In addition to the six-channel M.O.L.E. EV6, the company’s BreadOMETER™, CakeOMETER™, and OvenBALANCER™ sensors will be demonstrated at the stand.
Torsten Türling will be the new CEO of Syntegon Group from November 1, 2023, the packaging technology company announced. The current CEO, Dr. Michael Grosse, resigns as of October 31, after three years in this role.
In October, MECATHERM will launch at iba new solutions including its new M-VT vertical oven for bakery, pastry and patisserie products, its new M-RT molder designed for crusty breads, as well as solutions that help optimize energy consumption for production lines. MECATHERM will exhibit together with its sister company, ABI LTD.
Syntegon won the German Packaging Prize in the ‘packaging machines’ category, from the German Packaging Institute (Deutsches Verpackungsinstitut e.V.). Its IDH handling system incorporates innovative picker technology, which enables manufacturers to considerably reduce the space required from the infeed belt to the packaging machine
Syntegon announced the launch of four machines for common vertical form, fill and seal applications at interpack. Two SVX variants, SVX Agile and SVX Duplex, were presented at the interpack booth, which will be launched this year along with two other SVX models.
At interpack, Syntegon is presenting a flexible line concept for packaging sensitive baked goods – from product distribution to case packaging. The seamlessly integrated packaging system comes with several novelties.
There are clear requirements for the proofing process. The dough may be resting, but its transformation process does nothing but rest. The question is, always, how to improve the process? Technology brings new answers.
ECD’s M.O.L.E.™ EV6 touchscreen thermal profiler is now commercially available, with shipments starting April 1. The interface is said to have a user-friendly, intuitive design engineered to save baking professionals time, simplify data viewing and analysis, and improve productivity.
Among the solutions MECATHERM is presenting at IBIE, new digital services will debut, providing tools to help optimize process efficiency.