Syntegon showcases turnkey solutions at ProSweets
At ProSweets, Syntegon will showcase confectionery industry solutions – from kitchen, depositing, and finishing technologies to packaging solutions.
At ProSweets, Syntegon will showcase confectionery industry solutions – from kitchen, depositing, and finishing technologies to packaging solutions.
Torsten Türling will be the new CEO of Syntegon Group from November 1, 2023, the packaging technology company announced. The current CEO, Dr. Michael Grosse, resigns as of October 31, after three years in this role.
Syntegon won the German Packaging Prize in the ‘packaging machines’ category, from the German Packaging Institute (Deutsches Verpackungsinstitut e.V.). Its IDH handling system incorporates innovative picker technology, which enables manufacturers to considerably reduce the space required from the infeed belt to the packaging machine
DIOSNA Hall A2 – 340 DIOSNA will present smart, future-oriented solutions for the food industry in the areas of automation,
Syntegon announced the launch of four machines for common vertical form, fill and seal applications at interpack. Two SVX variants, SVX Agile and SVX Duplex, were presented at the interpack booth, which will be launched this year along with two other SVX models.
After a six-year break, DIOSNA returns to interpack with solutions for the food industry in the areas of fermentation, granulation and mixing.
At interpack, Syntegon is presenting a flexible line concept for packaging sensitive baked goods – from product distribution to case packaging. The seamlessly integrated packaging system comes with several novelties.
Booth 1201 – Diosna Diosna will focus on equipment flexibility, showcasing the DIOSNA Wendel Mixer WH 240 “A” of the
DIOSNA launched a new IoT solution for dough production. The system monitors the condition and product quality through live data. It can be accessed remotely.
A total of three Diosna wendel mixers take care of dough mixing Staff in the American supply chain centers of
Numerous exhibitors will present their innovations in Munich. The editors submit a couple of novelties to give trade fair visitors