Syntegon showcases turnkey solutions at ProSweets
At ProSweets, Syntegon will showcase confectionery industry solutions – from kitchen, depositing, and finishing technologies to packaging solutions.
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ECD iba ’23 preview: It’s not a sprint, it’s a marathon!
As the finishing line to this year’s iba preparations is quickly approaching, here are exhibitor stands worth marking in visiting
ECD brings touchscreen profiling technology to iba
ECD will bring its thermal profiling technology to iba in October. The handheld M.O.L.E.™ EV6 sets a new benchmark for thermal data loggers, delivering instantaneous data access and intuitive control – now with a full-color touchscreen display. In addition to the six-channel M.O.L.E. EV6, the company’s BreadOMETER™, CakeOMETER™, and OvenBALANCER™ sensors will be demonstrated at the stand.
New CEO for Syntegon Group: Torsten Türling
Torsten Türling will be the new CEO of Syntegon Group from November 1, 2023, the packaging technology company announced. The current CEO, Dr. Michael Grosse, resigns as of October 31, after three years in this role.
Syntegon wins fourth German Packaging Award
Syntegon won the German Packaging Prize in the ‘packaging machines’ category, from the German Packaging Institute (Deutsches Verpackungsinstitut e.V.). Its IDH handling system incorporates innovative picker technology, which enables manufacturers to considerably reduce the space required from the infeed belt to the packaging machine
It’s not a sprint, it’s a marathon! DIOSNA iba preview
DIOSNA Hall A2 – 340 DIOSNA will present smart, future-oriented solutions for the food industry in the areas of automation,
The product is the measure of things
Every gram counts. This is especially true when raw materials become more expensive or even scarce. VEMAG takes weight accuracy very seriously with its portioning technology. The machine manufacturer also sets the bar high in terms of product quality and flexibility.
Syntegon launches vertical bagging series
Syntegon announced the launch of four machines for common vertical form, fill and seal applications at interpack. Two SVX variants, SVX Agile and SVX Duplex, were presented at the interpack booth, which will be launched this year along with two other SVX models.
interpack: DIOSNA presents fermentation, granulation and mixing technology
After a six-year break, DIOSNA returns to interpack with solutions for the food industry in the areas of fermentation, granulation and mixing.
Syntegon showcases packaging system for baked goods
At interpack, Syntegon is presenting a flexible line concept for packaging sensitive baked goods – from product distribution to case packaging. The seamlessly integrated packaging system comes with several novelties.
ECD commercializes touchscreen-enabled thermal profiler
ECD’s M.O.L.E.™ EV6 touchscreen thermal profiler is now commercially available, with shipments starting April 1. The interface is said to have a user-friendly, intuitive design engineered to save baking professionals time, simplify data viewing and analysis, and improve productivity.
A guide to IBIE’s exhibition stands (Diosna)
Booth 1201 – Diosna Diosna will focus on equipment flexibility, showcasing the DIOSNA Wendel Mixer WH 240 “A” of the
